From chip cleaving and fully automated testing to high-precision AOI inspection — a complete portfolio of optical chip back-end equipment, engineered entirely in-house.
Optoelectronic performance testing in precisely controlled environments (+25°C to +85°C), with automated loading/unloading and intelligent self-cleaning.
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Automated testing and sorting of high-power LD chips across electrical and optical parameters, with precision temperature control and an integrating sphere.
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Normal to high-temperature optoelectronic testing with ±0.1°C precision temperature control for exceptional measurement repeatability.
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Dedicated low-temperature optoelectronic testing with ±0.1°C precision temperature control across a range of -55°C to +100°C.
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Automatically grabs, transfers, and precisely stacks bars into preset arrays, eliminating the accuracy limitations of manual placement.
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LIV, spectrum, and beam characteristic testing for LD bars, with NG chip dot marking and automated unloading.
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Comprehensive front/back LIV, spectrum, and divergence angle testing for CoC/CoS packaging, under ±0.1°C precision temperature control.
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Optoelectronic performance testing for BoS/CoB chips, supporting automated LIV, spectrum, and near/far-field beam characteristic measurements.
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Accurate measurement of APD chip dark current, responsivity, gain, and breakdown voltage under high-precision temperature control.
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Microscopic optics combined with deep learning algorithms for precise detection of sub-0.5 µm defects across multiple chip surfaces.
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High-precision machine vision and diamond blades for accurate alignment and scribing of 2–6 inch compound semiconductor wafers.
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High-precision ceramic tools with automated pressure and angle control for clean, consistent breaking of wafers and bars.
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Ultrafast laser with dual-focus technology for efficient stealth scribing, supporting 8-inch wafer auto-loading and warpage compensation.
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Supports blue tape rings and Gel-Paks, precisely selecting and redistributing chips based on mapping data or OCR identification.
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High-speed chip counting on blue tape, with integrated label printing, voice broadcast, and full data traceability.
View Specs →From precision motion control to proprietary algorithms — every critical capability developed and owned in-house.
World-class precision control systems enhanced with comprehensive machine vision for real-time position correction — ensuring stable operation and reliable data acquisition at scale.
Test probes, stages, nozzles, precision blades, anvils, laser stealth scribing optics, and SLM algorithms — every critical component developed and manufactured in-house.
Proprietary software and algorithms process high-volume data at speed, with seamless integration into customer MES/EAP systems for fully connected smart production lines.
Targeting SiC, GaN, Ga₂O₃, and CPO packaging applications — advancing laser stealth scribing and high aspect ratio drilling for next-generation semiconductor devices.
Fully proprietary technology means shorter lead times, lower procurement costs, and faster on-site support — advantages that are structural, not circumstantial.
No waiting for international service visits. Our resident engineers respond on-site, 24/7 — for routine maintenance, troubleshooting, and rapid upgrades.