Compound Semiconductor Scriber

Diamond-blade scribing equipment for precise straight-line scribing on compound semiconductor wafers and bars (2, 4, 6 inches). After scribing, chips are fully separated via a breaking process. Suitable for PD, LD, and high-power wafers. High-precision machine vision and fine motion control ensure accurate alignment and positioning. Scribing pressure and angle are automatically controlled for optimal results. Optional automated loading/unloading available.

High-Precision Smart Alignment
High-precision machine vision and fine motion control ensure accurate wafer and chip alignment.
Flexible Smart Control
Fully automated scribing pressure and angle adjustment ensures consistent, optimal results.

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Models

SY-0110A Type Compound Semiconductor Scriber

SY-0110AZ Type Fully Automated Compound Semiconductor Scriber (Intelligent)

Specifications

Supported Wafer Sizes

2, 4, 6 inches

Applicable Chip Types

PD, LD, and high-power wafers/bars of various sizes