About Thahoo

Built to Manufacture
Born to Innovate

China's leading "Little Giant" in optical chip back-end technology.

Mission

Advancing China's optical chip industry

Vision

World leader in back-end processing & testing

Our Journey

Milestones & Breakthroughs

From startup to industry leader — driven by a relentless pursuit of core technology.

2017 2020
Founding Phase

R&D Launch & Core Breakthrough

Assembled a world-class expert team and built China's first normal/high-temp and low-temp LD chip test machines — breaking a long-standing technology monopoly.

2021 2022
Growth Phase

National "Little Giant" Designation

Achieved large-scale production across multiple product lines. Awarded national SRDI "Little Giant" status. Acquired Pangnawei, entering the 3rd-generation semiconductor space.

2023 2024
Expansion Phase

New Industrial Park & Portfolio Expansion

Broke ground on Thahoo Industrial Park. Launched EML+SOA testers, 6-inch fully automatic cleaving machines, and AOI systems. Major advances in GaN and MLED R&D.

2025 Today~
Global Phase

Smart Factories & Globalization

Industrial Park delivered. Full smart optical chip line solutions deployed globally — bringing China's manufacturing precision to the world.

Global Presence

R&D and Service Network

Rooted in China, with a global vision. Our integrated R&D and service network ensures rapid response and excellence in delivery.

Shijiazhuang
Global HQ
Beijing
R&D Center
Xi'an
Customer Service Center
Shenzhen
R&D Center
Shanghai
R&D Center
Wuhan
Customer Service Center
Hsinchu
R&D Center
Shijiazhuang Global HQ
R&D Center
Beijing / Shenzhen / Shanghai / Hsinchu
Customer Service
Xi'an / Wuhan
R&D & Qualifications

Deep R&D.
Proven Expertise.

Hebei Engineering Research Center for Semiconductor Laser & Silicon Optical Chip Testing Hebei Information Optoelectronics Industry Technology Research Institute Shijiazhuang Optical Communication Chip Testing Technology Innovation Center Shijiazhuang Enterprise Technology Center

Backed by a robust patent portfolio and multiple provincial R&D platforms — continuously advancing the core technology of optical chip back-end testing.

32
National Patents
23
Utility Model Patents
Standards Development
Participating National Standard
GB/T 42706.7-2026 — Electronic components—Long-term storage of electronic semiconductor devices—Part 7:Micro-electromechanical devices
Lead Industry Standard
SJ/T 11997.1-2025 — Testing Methods for Semiconductor Laser Chips for Optical Fiber Communication, Part 1: Basic Optoelectronic Characteristics
CNAS Accredited Laboratory
CNAS Accredited Testing Center
Hebei Thahoo Optoelectronics Technology Co., Ltd. — Chip Testing Center
Accredited for FP, DFB, and EML semiconductor laser chip testing.