Foundry Services

China's Largest
Optical Chip OSAT Facility

8 years of process expertise. 8,000 m² cleanroom. 200+ proprietary equipment units. End-to-end manufacturing from wafer cleaving to final sorting — under one roof.

Explore Our Full-Process Capability
Cleanroom Facility
Optical Chip Wafer
1.5B+
Annual Chip Deliveries
8,000m²
High-Grade Cleanroom Facility
200+
Proprietary Equipment Units
12+
Production Lines
End-to-End Capability

Every Chip Type.
Every Process Step.

FP/DFB, PD/APD, EML, visible-light, and high-power chips — full coverage across dozens of optical chip types, processed end-to-end within a single cleanroom to minimize handling time and reduce cycle times.

Precision Cleaving

01 / Wafer & Bar Precision Cleaving

For compound semiconductors including GaAs, InP, and SiC — customized cleaving solutions covering laser stealth scribing, mechanical scribing, and precision cleaving, matched to each material's specific crystallographic requirements.

Laser Stealth Scribing Mechanical Scribing Precision Cleaving
Optoelectronic Testing

02 / Wide-Temperature Optoelectronic Testing

A large fleet of proprietary testers spanning -65°C to +95°C, with millisecond-level response times. 100% optoelectronic characterization of every chip — no sampling.

Room / High / Low Temperature Bar Testing LIV Curve Analysis
AOI Inspection

03 / Four-Side AOI Inspection & Sorting

The final gate before delivery. High-precision four-side machine vision detects micron-level surface defects, followed by automated sorting and packaging to 100% customer specification conformance.

Four-Side Vision Scanning Laser Focusing Automated Sorting
Why Choose Us

An Equipment Maker Running a Foundry.
That Changes Everything.

Because we build our own equipment, we control cost, cycle time, and data security at a level no conventional foundry can match.

01
No Equipment Depreciation.
Up to 80% Lower Foundry Cost.
We manufacture the equipment ourselves — so there is no third-party depreciation burden passed to you. Compared to conventional foundries, total processing costs can be reduced by up to 80%.
02
Rapid NPI.
Non-Standard Chips Welcome.
Our process and software teams can modify equipment algorithms and process recipes directly — enabling fast adaptation to non-standard geometries and cutting-edge chip architectures that off-the-shelf tools cannot handle.
03
Physical & System-Level
Data Isolation.
Built on our proprietary EAP and MES systems, your process data is isolated at both the hardware and software level. Your IP stays yours — by architecture, not just policy.
Global Certifications
CE
EU Market Access
UKCA
UK Market Access
SEMI
Semiconductor Standards
UL
North America Safety