Compound Semiconductor Breaker

Advanced breaking machine using high-precision ceramic tools to break GaAs, InP, GaN, SiC, and AlN wafers and bars up to 6 inches. Suitable for efficient separation of PD, LD, and high-power chips. Combines high-precision machine vision and fine motion control to automatically adjust breaking pressure and angle for a perfect cleave facet. Supports optional automated loading/unloading.

Wide-Field High-Precision Positioning
High-precision machine vision and fine motion control ensure pixel-level alignment before breaking.
Universal Hard-Brittle Material Support
Dynamic pressure and angle control improve precision and compatibility with virtually all hard-brittle semiconductor substrates.

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Models

SY-0120A Type Compound Semiconductor Breaker

SY-0220AZ Type Fully Automated Compound Semiconductor Breaker (Intelligent)

Specifications

Compatible Substrates

GaAs, InP, GaN, SiC, AlN wafers and bars

Maximum Size

Up to 6 inches