Integrating microscopic optics and machine vision, this equipment detects defects on four chip surfaces in real time. It achieves precise recognition of microscopic defects down to 0.5 microns (0.1 microns/pixel). Based on deep learning, it accurately classifies defects including cracks, stains, chipping, coating peeling, waveguide damage, cleave fractures, scratches, uneven coating, indentations, gold layer delamination, missing characters, and uneven back-side gold deposition. High-precision anti-vibration platforms and microscope cameras ensure quality inspection across all HR, AR, P, and N surfaces.