1600 × 1300 × 2000 mm, Approx. 1000kg
Series Products
8-Inch Laser Stealth Dicer
This equipment uses ultrafast laser modification of semiconductor materials to focus ultra-short pulse laser beams inside the wafer, forming a modified layer along the cutting path to achieve stealth dicing. It features fully automated loading/unloading for unmanned workshop environments. After stealth dicing, a matching breaking machine is used to perfectly separate the wafer into individual chips.
Dual-Focus Speed Tech
Proprietary dual-focus technology processes two layers simultaneously, significantly multiplying throughput.
Adaptive Warpage Compensation
Integrated laser ranging for real-time detection of wafer surface warpage with automatic Z-axis height compensation.
Models
LSD-0810A Type 8-Inch Laser Stealth Dicer
Specifications
Compatible Materials
Mainly suitable for SiC, Si, GaN, InP, etc.
Supported Sizes & Applications
Up to 8-inch lossless dicing, widely used for LED, LD, and power devices