Fully Automated Chip Tester

Mainly used for LD chip optoelectronic performance testing in a +25°C~+85°C (±0.1°C) controlled environment. Synchronously tests front and back LIV characteristics, spectral characteristics, and beam characteristics. Features fully automated loading/unloading to minimize labor input.

Full Process Automation
Automatic loading/unloading, carrier ID recognition and marking, and automatic probe/nozzle cleaning.
Multi-Station Sync Testing
Multi-station design for efficient parallel testing across dimensions including spectrum and divergence angle.

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Models

SY-5203SF Type Fully Automated Four-Station Visible Light Chip Tester (Intelligent)

CTA-7300 Type Fully Automated Normal/High-Temp Chip Tester (Intelligent)

Specifications

Supported Chip Types

LD, FP, EML, EML(SOA)

Chip Size Limits (L×W×H)

(150~1200)μm × (120~600)μm × (100±10)μm

Wavelength Range

200nm ~ 1700nm

Power Range

1μW ~ 30W